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Parallel Seam Welding of Airtight Packaging Basis Ⅱ

2024-07-01

Popularization of Science| Parallel Seam Welding of Airtight Packaging Basis Ⅰ

2024-05-28

Introduction to the gold-tin melting and sealing process of vacuum eutectic furnace reflow furnace

2023-03-28

In the field of military and civilian high-reliability electronics, the air tightness of the package is one of the most important reliability indicators. The airtight packaging of gold-tin alloy not only has good sealing and high temperature resistance, but its process also has many advantages: (1) There is no requirement for the thickness of the cover plate, the mechanical strength after sealing and welding is large, and the pressure resistance of the cover plate is large.；

Technical matters regarding the structure and use of metal capping machine equipment

2022-11-22

Huachuang HC-DL145 type cover opener is a special cover plate for research and development to remove airtight packaged devices (parallel sealing and welding), and can perform rework, quality control or defect analysis of the devices.After opening the lid, the sealing and welding layer of the device base is not damaged, and the surface is smooth.During the entire disassembly process, no dust particles contaminate the device, no vibration and shock, and the size of the device will not be changed. After the lid is removed, the device can be repackaged.In addition, the equipment meets the requirements for the use of ultra-clean workshops.

Parallel sealing and welding machine equipment structure and technical matters

2022-11-21

Huachuang HC-SM150 is the key equipment for airtight packaging of microwave integrated components, T/R components, MEMS devices, power modules, photoelectric devices, laser devices and other components in the subsequent process.By controlling the sealing and welding power supply, the energy is evenly released to the edges of the device cover plate and the base, and the cover plate and the base are welded together. Good sealing and welding equipment is the best guarantee of the air tightness of microelectronic devices, and it is also a key factor to ensure the long-term stable operation of the device.

Application and function of parallel sealing and welding machine

2022-11-17

Parallel seam welding machine Because of its small solder joints and coincident solder joints,the welds formed are like the seam patterns of sewing clothes on a sewing machine.Also known as parallel seam welding machine,it uses the principle of resistance welding and heating to seal and weld the tube and shell cover plate,which is airtight encapsulation.Most of the electronic components in the tube and shell are power devices,microwave radio frequency devices,laser devices,optoelectronics devices,microelectronic sensors,etc.,which can prevent the external atmosphere from entering the cavity,reduce the sensitivity of the device,reduce the service life,and even affect the performance of the device.

Application and principle of parallel sealing and welding machine

2022-11-16

Parallel seam welding machine is also known as parallel seam welding machine because of its small solder joints and coincident solder joints. It is suitable for linear, linear array or rotating body packaging of products such as power devices, microwave radio frequency devices, laser devices, optoelectronics, microelectronic sensors, etc. Due to the small size of the solder joints and the overlap of the solder joints, the welds formed are like the seams of sewing machines sewing clothes.The size can cover 3mm-200mm rectangular tube shell and round tube shell with a diameter of less than φ150mm.

Application principle of vacuum reflow oven

2022-11-15

Vacuum reflow furnace is to perform high-quality eutectic welding of products in a vacuum environment. Therefore, it is also known as vacuum eutectic furnace, vacuum eutectic reflow soldering furnace, vacuum sintering furnace, etc. It is used under vacuum conditions to protect the product and the solder from oxidation. At the same time, the hydrogen atoms decomposed by formic acid are used to react the product with the oxide on the surface of the solder, which improves the weldability of the welding surface, while providing solder wettability, which better reduces the void rate of welding.It is generally used in products with high precision requirements such as aerospace, optoelectronics, medical care, automobiles, etc. The vacuum reflow oven, like the ATV vacuum reflow oven, adopts the heating principle of infrared quartz lamp directly radiating silicon carbide heating plate. It has the characteristics of high temperature control accuracy (±0.5℃), good temperature uniformity (±1%), controllable temperature rise and fall, real-time display of process curves, real-time preservation, and traceability analysis. It meets the needs of power devices, TR components, laser devices, optical devices, new sensor devices, etc. Multi-variety, small batch, and high-reliability welding. The application principle of the vacuum reflow oven is specifically to place the solder sheet into the tube and shell, and then place the chip on the solder sheet to assist the pressure or rely on the chip's own gravity to provide the pressure, or place the solder (solder paste) on the substrate or carrier, and then place the chip. Positioning and pressure assistance can also be achieved through a fixture. After the product is placed, close the door cover of the vacuum reflow oven chamber and perform the following curve welding, as shown in the figure. Take gold-tin solder as an example; first fill with nitrogen and vacuum 2-3 times to replace the internal atmosphere of the cavity, and then heat up to 200℃. Heat preservation, at the same time, when the surface temperature of the product reaches 160-180℃, a formic acid air flow is introduced to activate and reduce the surface of the sample to improve the content wettability, and then heat up and keep warm. The main control heat preservation is set at 330℃ (because the melting point of the gold-tin solder is 283℃, according to the process characteristics, it is necessary to reserve the hot melt, that is, the temperature required for conduction from the hot plate to the surface of the sample) for heat preservation. At this time, the solder reaches the melting point and is in a molten liquid phase state, supplemented by vacuum to discharge air bubbles, so as to achieve the purpose of low-hole welding, and then cool down. According to different products, you can Rapid cooling or controllable cooling, that is, different cooling stages can be set to achieve different material properties.

Brief description of the use instructions and technical characteristics of Huachuang intelligent lid opener

2022-11-14

The capping machine is a non-destructive milling and cutting of the cover plate through a precision milling cutter, which can realize the secondary capping, also known as the capping machine, also known as the capping machine.It is suitable for metal-encapsulated photoelectric devices, thick-film circuits, optical communication devices, quartz crystal oscillators and other devices.Removing the lid is non-destructive.

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