Home
About Us
Company Profile
Culture
Honor
Products
Vacuum Reflow Oven
Parallel Seam Sealing Machine
De-lidder
Wire Bonder, Die Bonder& Inspection Equipment
Spare Parts
Technical Application
Technical Article
Application Cases
Popular Science Articles
News
Company News
Industry News
Recruitment
Contact Us
CN|EN
Technology application
Technical article
Application case
Popular science articles
Parallel Seam Welding of Airtight Packaging Basis Ⅱ
2024-07-01
Introduction to the gold-tin melting and sealing process of vacuum eutectic furnace reflow furnace
2023-03-28
In the field of military and civilian high-reliability electronics, the air tightness of the package is one of the most important reliability indicators. The airtight packaging of gold-tin alloy not only has good sealing and high temperature resistance, but its process also has many advantages: (1) There is no requirement for the thickness of the cover plate, the mechanical strength after sealing and welding is large, and the pressure resistance of the cover plate is large.;
Technical matters regarding the structure and use of metal capping machine equipment
2022-11-22
Huachuang HC-DL145 type cover opener is a special cover plate for research and development to remove airtight packaged devices (parallel sealing and welding), and can perform rework, quality control or defect analysis of the devices.After opening the lid, the sealing and welding layer of the device base is not damaged, and the surface is smooth.During the entire disassembly process, no dust particles contaminate the device, no vibration and shock, and the size of the device will not be changed. After the lid is removed, the device can be repackaged.In addition, the equipment meets the requirements for the use of ultra-clean workshops.
Parallel sealing and welding machine equipment structure and technical matters
2022-11-21
Huachuang HC-SM150 is the key equipment for airtight packaging of microwave integrated components, T/R components, MEMS devices, power modules, photoelectric devices, laser devices and other components in the subsequent process.By controlling the sealing and welding power supply, the energy is evenly released to the edges of the device cover plate and the base, and the cover plate and the base are welded together. Good sealing and welding equipment is the best guarantee of the air tightness of microelectronic devices, and it is also a key factor to ensure the long-term stable operation of the device.
Application and function of parallel sealing and welding machine
2022-11-17
Parallel seam welding machine Because of its small solder joints and coincident solder joints,the welds formed are like the seam patterns of sewing clothes on a sewing machine.Also known as parallel seam welding machine,it uses the principle of resistance welding and heating to seal and weld the tube and shell cover plate,which is airtight encapsulation.Most of the electronic components in the tube and shell are power devices,microwave radio frequency devices,laser devices,optoelectronics devices,microelectronic sensors,etc.,which can prevent the external atmosphere from entering the cavity,reduce the sensitivity of the device,reduce the service life,and even affect the performance of the device.
Application and principle of parallel sealing and welding machine
2022-11-16
Parallel seam welding machine is also known as parallel seam welding machine because of its small solder joints and coincident solder joints. It is suitable for linear, linear array or rotating body packaging of products such as power devices, microwave radio frequency devices, laser devices, optoelectronics, microelectronic sensors, etc. Due to the small size of the solder joints and the overlap of the solder joints, the welds formed are like the seams of sewing machines sewing clothes.The size can cover 3mm-200mm rectangular tube shell and round tube shell with a diameter of less than φ150mm.
Brief description of the use instructions and technical characteristics of Huachuang intelligent lid opener
2022-11-14
The capping machine is a non-destructive milling and cutting of the cover plate through a precision milling cutter, which can realize the secondary capping, also known as the capping machine, also known as the capping machine.It is suitable for metal-encapsulated photoelectric devices, thick-film circuits, optical communication devices, quartz crystal oscillators and other devices.Removing the lid is non-destructive.