The de-lidder is used for the devices with square metal lids, such as photoelectric device, hybrid circuit device, optical communication device, quartz-crystal oscillator and so on. De-lidding is non-destructive, and the de-lidder can be used for re-sealing of the lid after rework.
The automatic de-lidder is suitable for the devices with square, round or irregular shaped metal lids, such as photoelectric device, TR component, hybrid circuit device, optical communication device, quartz-crystal oscillator and so on. De-lidding is non-destructive, and the de-lidder can be used for re-sealing of the lid after rework.
HC-EB820 Multifunctional Wire bonder
Multifunctional wire bonder is one of the key and specialized equipment in the packaging production of high-performance electronic components, suitable for the application of the interconnection process between chip’s internal pins and external. It is widely used in microwave device, RF modules, hybrid circuits, MEMS circuits, photoelectric device, sensors, nanodevices, semiconductor devices, radar devices, metal and ceramic packaging devices, special circuits, COB/SOB and so on.
SM200W Semi-automatic Parallel Seam Sealing Machine
Parallel seam sealing system is a high performance and specialized equipment for sealing setal and ceramic hermetic base.