Products
- Product Description
- Technical Parameters
- Technical Advantage
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Microwave plasma cleaning machine is suitable for micro-cleaning, surface activation, modification, deoxidation, etching, descum and other applications of materials surface, especially for the non-damage cleaning with chips of microelectronic package applications before die bonding, and underfill, etc.
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Drag and drop the drop-down bar on the right to view more parameters
Specification
HC-PL12
HC-PL70
External size
W880mm*H620mm*D720mm
W860mm*H1900mm*D1050mm
Internal size of chamber
W225mm*H225mm*D225mm
W425mm*H365mm*D465mm
Microwave power
2.45GHz,100W-500W adjustable
2.45GHz,100W-1000W adjustable
Gas inlet
Standard 2 channels, including MFC and magnetic valve
Standard 2 channels, including MFC and magnetic valve
Vacuum interface
DN16KF
DN40KF
Power supply
380V,50/60Hz 3.3KW including vacuum pump
380V,50/60Hz 4.3KW including vacuum pump
Control unit
Touch screen PLC control
Touch screen PLC control
Vacuum gauge
Pirani vacuum gauge
Pirani vacuum gauge or capacitiance manometer
Main application
Organic contaminant removal, surface activization, oxide reduction,
PR descum, and surface polymerization coating, etc.
Organic contaminant removal, surface activization, oxide reduction,
PR descum, and surface polymerization coating, etc.
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Plasma cleaning with no damage.
Easy-to-use graphical interface.
Make small holes and slits clear.
No electrode sputtering contamination.
Low cleaning temperature.
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