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Microwave Plasma Cleaning Machine

Classification:

Other 2

Key words:

  • Product Description
  • Technical Parameters
  • Technical Advantage
  • Microwave plasma cleaning machine is suitable for micro-cleaning, surface activation, modification, deoxidation, etching, descum and other applications of materials surface, especially for the non-damage cleaning with chips of microelectronic package applications before die bonding, and underfill, etc.

  • Drag and drop the drop-down bar on the right to view more parameters

    Specification

    HC-PL12

    HC-PL70

    External size

    W880mm*H620mm*D720mm

    W860mm*H1900mm*D1050mm

    Internal size of chamber

    W225mm*H225mm*D225mm

    W425mm*H365mm*D465mm

    Microwave power

    2.45GHz,100W-500W adjustable

    2.45GHz,100W-1000W adjustable

    Gas inlet

    Standard 2 channels, including MFC and magnetic valve

    Standard 2 channels, including MFC and magnetic valve

    Vacuum interface

    DN16KF

    DN40KF

    Power supply

    380V,50/60Hz 3.3KW including vacuum pump

    380V,50/60Hz 4.3KW including vacuum pump

    Control unit

    Touch screen PLC control

    Touch screen PLC control

    Vacuum gauge

    Pirani vacuum gauge

    Pirani vacuum gauge or capacitiance manometer

    Main application

    Organic contaminant removal, surface activization, oxide reduction,

    PR descum, and surface polymerization coating, etc.

    Organic contaminant removal, surface activization, oxide reduction,

    PR descum, and surface polymerization coating, etc.

  • Plasma cleaning with no damage.

    Easy-to-use graphical interface.

    Make small holes and slits clear.

    No electrode sputtering contamination.

    Low cleaning temperature.

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