Products
- Product Description
- Technical Parameters
- Technical Advantage
-
Multifunctional die bonder is one of the key and specialized equipment in the packaging production of high-performance electronic components, suitable for sticking the die to the lead frame. It is widely used in microwave device, RF modules, hybrid circuits, MEMS circuits, photoelectric device, sensors, nanodevices, semiconductor devices, radar devices, military devices, special circuits, COB/SOB and so on.
-
Die Bond head
Z vertical travel by manipulator
14mm
X-Y travel by manipulator
15mmx15mm（Ratio8:1）
Work flatform
Elevating table Z travel
18mm
Elevating table X-Y area
250mmx270mm
Die bond force
10g-150g
Chip size
0.2mm-25mm
Operation menu
"TFT color LCD, Chinese/English Menu
Power
AC220V±10%(50/60Hz) ≤400W
Machine profile
650*650*400mm（Length*width*height）
Weight
About 70Kg
Standard features
Mainframe, LED Illumination, Zoom Stereo-Microscope,Workholder, Pick-up Tool and Dispensing Tool.
-
Die bond head structure: Dispensing, die taking, die placing, and die bonding are realized on the same die bonder. Axis θ rotates 360 degrees.
Dispensing head: It has the function of dispensing, line drawing and printing, controlled by microcomputer. The parameters of dispensing time and amount can be programmed.
XY stage: Adopt linear guide rail mechanism, which has high positioning accuracy.
Lifting platform: Adopt four bar mechanism for vertical lifting.
Previous
Next
Previous
Next
Related Products
Message consultation
Contact Us
Yantai Headquarters: No.39 Xiamen Street, Yantai Area, China (Shandong) Free Trade Zone
North China Sales and Service Center: High-tech Industrial Development Zone, Zhuozhou City, Baoding City, Hebei Province, and Valley Science and Technology Industrial Institute
Northwest R & D, Sales and Service Center: Zhongxing Shenlan Science and Technology Industrial Park, Science and Technology Planning Resource Demonstration Zone, Fengdong New City, Xixian New District, Xi 'an, Shaanxi Province
Southwest Sales and Service Center: Information Optoelectronic Industry Base, 188 Guangyao 3rd Road, Qingyang District, Chengdu City, Sichuan Province
South China Sales and Service Center: Honghualing Craftsmanship Industrial Park, Taoyuan Street, Nanshan District, Shenzhen City
Contact Phone: 0086 535 6388095 / 0086 535 3021333 / +8613255522639
Mailbox: nancyzhang@pcm-bj.com
Yantai Huachuang Intelligent Equipment Co., Ltd. All Rights Reserved | SEO
