Products
HC-EB820 Multifunctional Wire bonder
Multifunctional wire bonder is one of the key and specialized equipment in the packaging production of high-performance electronic components, suitable for the application of the interconnection process between chip’s internal pins and external. It is widely used in microwave device, RF modules, hybrid circuits, MEMS circuits, photoelectric device, sensors, nanodevices, semiconductor devices, radar devices, metal and ceramic packaging devices, special circuits, COB/SOB and so on.
Classification:
Wire Bonder, Die Bonder& Inspection Equipment
Key words:
- Product Description
- Technical Parameters
- Technical Advantage
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Multifunctional wire bonder is one of the key and specialized equipment in the packaging production of high-performance electronic components, suitable for the application of the interconnection process between chip’s internal pins and external. It is widely used in microwave device, RF modules, hybrid circuits, MEMS circuits, photoelectric device, sensors, nanodevices, semiconductor devices, radar devices, special circuits, COB/SOB and so on.
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Bonding head
Z vertical travel by Manipulator
14mm
Other parameters
X-Y travel by Manipulator
15mmx15mm (Ratio 8:1)
Ball size: 1.5 to 4 times the diameter of the welding wire
Wire spool Mount: 2”
Temperation controller: up to 300℃
Operation Menu: 7” TFT color LCD, Chinese Menu
Power: AC220V±10% (50/60Hz) ≤800W
Machine profile: 650x650x400mm
Weight: about 70KgElevating table
Z travel
18mm
X-Y travel by Manipulator
250mmx270mm
Ultrasonic power
0-3W
Programmable Force
10g-50g/10g-100g
Wire dia
Gold wire 18μm-50μm，Al wire 18μm-75μm
EFO system
N-EFO(-1500V) Ball size: 1.5-4 times of wire dia（only ball-bonding）
Standard Features
Mainframe/ 2”Wire spool/ LED Illumination/ Zoom Stereo-Microscope/ workholder/
Temperature control module/EFO system(wedge bond not）Optional Accessory
Special workholder/Bond tool heater (up to 300℃) /Kit (Force gauge, tweezers, etc.)/
Bonding Tools and Wire/ 1/2” Wire spool -
It can be configured as ball bonding, wedge bonding, or ball-wedge bonding.
Voice coil motor applies bonding pressure.
Multi-link structure handle is flexible and convenient to operate.
Multi-link structure handle is flexible and convenient to operate.
Related Products
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Contact Us
Yantai Headquarters: No.39 Xiamen Street, Yantai Area, China (Shandong) Free Trade Zone
North China Sales and Service Center: High-tech Industrial Development Zone, Zhuozhou City, Baoding City, Hebei Province, and Valley Science and Technology Industrial Institute
Northwest R & D, Sales and Service Center: Zhongxing Shenlan Science and Technology Industrial Park, Science and Technology Planning Resource Demonstration Zone, Fengdong New City, Xixian New District, Xi 'an, Shaanxi Province
Southwest Sales and Service Center: Information Optoelectronic Industry Base, 188 Guangyao 3rd Road, Qingyang District, Chengdu City, Sichuan Province
South China Sales and Service Center: Honghualing Craftsmanship Industrial Park, Taoyuan Street, Nanshan District, Shenzhen City
Contact Phone: 0086 535 6388095 / 0086 535 3021333 / +8613255522639
Mailbox: nancyzhang@pcm-bj.com
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