Products
VS210H Vacuum Reflow System
Classification:
High-performanced Vacuum Reflow Oven
Key words:
- Product Description
- Technical Parameters
- Technical Advantage
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Vacuum reflow system is the specialized equipment which provides a good process environment for alloy soldering of electronic devices by using the principle of vacuum heating, auxiliary formic acid, positive pressure and other technolog / ical means. The equipment is widely used in high-power semiconductor laser, optical communication semiconductor laser, Lidar device, TR component, hybrid circuit, /discrete device, MEMS device, IGBT, high-power LED, infrared device and other advanced device packaging. It can realize the perfect soldering of high reliability, high vacuum and low cavity of this kind of device.
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Technical Parameters
HC-VS210E
HC-VS200E
HC-VS210H
HC-VS330H
HC-VS460H Maximum temperature
450℃
450℃
450℃ (Higher optional)
450℃ (Higher optional)
450℃
Temperature control precision
±0.5℃
±0.5℃
±0.5℃
±0.5℃
±0.5℃
Area of heating plate
(227*217)mm2
(350*290)mm2
(227*217)mm2
(330*320)mm2
(460*420)mm2
Temperature uniformity
±1.5%
±1.5%
±1%
±1%
≤±2%
Ultimate vacuum(mechanical pump)
≤5Pa
≤5Pa
≤5Pa
≤5Pa
≤5Pa
Ultimate vacuum(Molecular pump)
N
N
≤5x10-3pa (Higher optional)
≤5x10-3pa (Higher optional)
N
Leakage rate of vacuum chamber
5x10-8 mbar*l/s
5x10-8 mbar*l/s
5x10-9 mbar*l/s
5x10-9 mbar*l/s
5x10-9 mbar*l/s
Formic acid process module
标配
标配
标配
标配
标配
Positive pressure function
N
N
0.3MPa
0.3MPa
N
Maximum heating rate
(bottom heating without load)200℃/min
200℃/min
200℃/min
200℃/min
200℃/min
Maximum cooling rate
(N2-cooled without load)100℃/min
100℃/min
100℃/min
100℃/min
100℃/min
Maximum height of device
100mm
100mm
100mm（150mm）
100mm（150mm）
100mm
Top heating
N
N
Optional
Optional
Standard
Water cooling
N
N
N
Optional
Optional
Chamber door open/close
Semi-automatic Semi-automatic Automatic Automatic Automatic MES interface
Optional
Optional
Standard
Standard
Standard
Barcode scanner
Optional
Optional
Optional
Optional
Optional
Flux module
N
Optional
N
Optional
Optional
* The temperature uniformity is tested and verified by a third-party TC Wafer. The temperature is tested and calibrated with thermoregulator from American Omega.
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1、Software: The interface of software is simple and intuitive. The data and process curves can be freely controlled, and the software supports offline viewing and analysis.
2、The capability of temperature control: The equipment uses Germany Siemens industrial control system and Siemens temperature measurement module for accurate closed-loop control. The temperature control accuracy is ±0.5℃.
3、Heating module: The infrared quartz lamp imported from Japan is used for radiation heating, and the life of the lamp is 5000 hours at full power.
4、Temperature control method: Partition temperature control is adopted. Independent intellectual property rights. PID adjusts the inported power regulator automatically for precise temperature control. The temperature uniformity in effective area is measured by TC Wafer with ≤ ±1~1.5%.
5、Positive pressure process: 0.3MPa. The accuracy of pressure control is ±5%, which can effectively remove tiny holes, control solder overflow, and prevent flux spatter. It is especially suitable for the welding of diode laser bar and high-power diode laser chip, vacuum packing of MEMS device, AuSn seal of electronic device, Micro-LED packing and other applications for advanced packing.
6、Process gas path: There are 2 MFC for precise control. The nitrogen flow rate is 50slm, and the formic acid flow rate is 30slm.
7、Cooling method: Air cooling/ water cooling. Water cooling can be used in vacuum seal process. The cooling rate is controllable, and the stress after welding can be effectively improved.
8、Chamber lid: The lid has the function of opening and closing safety protection, which can automatically open and close without impact.
9、MES function: With open OPC/UA protocol, users can simply interconnect with MES system.
10、Automation integration: With the upgraded online automatic loading and unloading function, the machine hand can automatically take and place samples. The barcode scanner scans codes online, and the chamber door opens and closes automatically and executes procedures.
11、Safety function: Overtemperature protection function, water flow and air pressure monitoring function, formic acid pipeline pressure control, chamber door interlock function under positive pressure.
12、The equipment supports the rapid temperature rise and fall heat treatment process of the bare wafer.
13、Multistage pressure and vacuum control are optional.
*Note: the preceding advantages or functions are subject to actual configurations.
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Yantai Headquarters: No.39 Xiamen Street, Yantai Area, China (Shandong) Free Trade Zone
North China Sales and Service Center: High-tech Industrial Development Zone, Zhuozhou City, Baoding City, Hebei Province, and Valley Science and Technology Industrial Institute
Northwest R & D, Sales and Service Center: Zhongxing Shenlan Science and Technology Industrial Park, Science and Technology Planning Resource Demonstration Zone, Fengdong New City, Xixian New District, Xi 'an, Shaanxi Province
Southwest Sales and Service Center: Information Optoelectronic Industry Base, 188 Guangyao 3rd Road, Qingyang District, Chengdu City, Sichuan Province
South China Sales and Service Center: Honghualing Craftsmanship Industrial Park, Taoyuan Street, Nanshan District, Shenzhen City
Contact Phone: 0086 535 6388095 / 0086 535 3021333 / +8613255522639
Mailbox: nancyzhang@pcm-bj.com
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