Yantai Huachuang cordially invites you to attend SEMICON China 2024 and Munich Shanghai Optical Fair 2024.
Release time
2024-03-07
2024 is a new start for the New Year. Yantai Huachuang will participate in SEMICON China 2024 and Munich Shanghai Optical Fair 2024 located in Shanghai New International Expo Center, when it will bring Vacuum Reflow Oven, Parallel Seam Sealing Machine, De-lidder, PIND and other equipment.
March 20-22, see you there!
Booth Location
SEMICON Booth No.: N5-5522
Munich Booth No.：W3-3260
First Look for Equioment
HC-VS330G can meet the sealing and welding requirements of MEMS devices such as gyroscopes, acceleration sensors and infrared sensors under high vacuum conditions, while achieving thermal and electrical activation of getter under high vacuum environment. The system can be used for scientific research and mass production of devices.
HC-MPVS500 multilayer vacuum reflow oven is the specialized equipment which provides a good process environment for alloy welding of electronic devices by using the principle of vacuum heating, auxiliary formic acid and other technological means.
Low cavity welding for chips and substrates of high-power semiconductor laser, optical communication semiconductor laser, hybrid circuit, MEMS devices, discrete devices and other advanced devices; Au-Sn fusion welding of ceramic devices and micro devices; Infrared devices In column reflux; Material annealing, etc.
De-lidding is no-destructive, and the de-lidder can be used for re-sealing of the lid after rework. Undamaged de-lidding of high-power semiconductor laser, optical communication semiconductor laser, hybrid circuit, MEMS devices, discrete devices, microwave and radio frequency devices, infrared devices, and other hermetic parallel seam sealed devices.
It’s suitable for the devices with square, round or irregular shaped metal lids, such as photoelectric devices, TR components, hybrid circuit devices, optical communication devices, quartz-crystal oscillator and so on. De-lidding is non-destructive, and the de-lidder can be used for re-sealing of the lid after rework.
By vacuum baking and the sealing process in the glove box, the low water vapor and low oxygen content in the base after sealing can be effectively reduced and maintained, meeting the use requirements of long life, high performance and high reliability of electronic devices in harsh environments
The hermetic sealing of metal or ceramic bases: high-power semiconductor laser, optical communication semiconductor laser, hybrid circuit, MEMS devices, discrete devices, microwave and radio frequency devices, infrared devices, etc.
The instrument is mainly used to detect the collision noise of the excess particles in the electronic components after packaging, aiming at detecting the excess particles in the device sealing chamber. It is suitable for detecting loose particles in the packaging chamber of electronic components, such as integrated circuits and discrete devices.
Yantai Huachuang is looking forward to meeting new and old friends at the first exhibition after the Spring Festival in 2024. Our booth No. is N5-5522 andW3-3260. Waiting for your visit!
Related information
Contact Us
Yantai Headquarters: No.39 Xiamen Street, Yantai Area, China (Shandong) Free Trade Zone
North China Sales and Service Center: High-tech Industrial Development Zone, Zhuozhou City, Baoding City, Hebei Province, and Valley Science and Technology Industrial Institute
Northwest R & D, Sales and Service Center: Zhongxing Shenlan Science and Technology Industrial Park, Science and Technology Planning Resource Demonstration Zone, Fengdong New City, Xixian New District, Xi 'an, Shaanxi Province
Southwest Sales and Service Center: Information Optoelectronic Industry Base, 188 Guangyao 3rd Road, Qingyang District, Chengdu City, Sichuan Province
South China Sales and Service Center: Honghualing Craftsmanship Industrial Park, Taoyuan Street, Nanshan District, Shenzhen City
Contact Phone: 0086 535 6388095 / 0086 535 3021333 / +8613255522639
Mailbox: nancyzhang@pcm-bj.com
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