Products
Multilayer Vacuum Reflow Oven
equipment which provides a good process environment for alloy welding of electronic devices by using the principle of vacuum heating, auxiliary formic acid and other technological means. The equipment is widely used in IGBT,high-power LED, high-power semiconductor laser,optical communication semiconductor laser, Lidar devices,TR components, hybrid circuits, discrete devices, MEMS devices, infrared devices and other high-end device packaging.It can realize the perfect welding of high reliability,high vacuum and low cavity of this kind of device.
Classification:
Multi-layer Vacuum Reflow Oven
Key words:
- Product Description
- Technical Parameters
- Technical Advantage
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equipment which provides a good process environment for alloy welding of electronic devices by using the principle of vacuum heating, auxiliary formic acid and other technological means. The equipment is widely used in IGBT,high-power LED, high-power semiconductor laser,optical communication semiconductor laser, Lidar devices,TR components, hybrid circuits, discrete devices, MEMS devices, infrared devices and other high-end device packaging.It can realize the perfect welding of high reliability,high vacuum and low cavity of this kind of device.
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Technical parameters/ Model
HC-MPVS500
Max. temperature
450℃
Temperature control precision
±1℃
Area of heating plate
520mm*500mm
Layer quantity of heating plate
3
Spacing between heating plate
150mm（Net height）
Temperature uniformity
±3℃(85% valid area）
Ultimate vacuum
2*10-2mbar（5*10-5mbar optional）
Process gas path
2路（N2、formic acid）
Max. heating rate
50℃/min
Max. cooling rate
100℃/min
Cooling method
Water cooling+Air cooling
Single layer bearing
25kg
Solder paste technology
Support
Dimension
1160mm*1450mm*2300mm
Weight
About 1000kg
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1、Software system: The interface of software is simple and intuitive. The data and process curve can be freely controlled.
2、The capability of temperature control: The equipment uses Germany Siemens industrial control system and Siemens temperature measure-ment module for accurate closed-loop control.
3、Temperature control method: Independent intellectual property rights. PID adjusts the AEG power regulator automatically for precise temperature control.
4、Temperature measurement method: There is 1 thermocouple for main control, 1 thermocouple for overtemperature protection, and 2 movable thermocouples
5、Cooling method: Air cooling/ water cooling. Water cooling can be used in vacuum sealing process.
6、Safety function: Overtemperature protection function, water flow and air pressure monitoring function, and formic acid pipeline pressure control.
7、MES function: With open OPC/ UA protocol, users can simply interconnect with MES system.
8、Process gas path: There are 2 MFC for precise control. The nitrogen flow rate is 50SLM, and the formic acid flow rate is 30SLM.
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Yantai Headquarters: No.39 Xiamen Street, Yantai Area, China (Shandong) Free Trade Zone
North China Sales and Service Center: High-tech Industrial Development Zone, Zhuozhou City, Baoding City, Hebei Province, and Valley Science and Technology Industrial Institute
Northwest R & D, Sales and Service Center: Zhongxing Shenlan Science and Technology Industrial Park, Science and Technology Planning Resource Demonstration Zone, Fengdong New City, Xixian New District, Xi 'an, Shaanxi Province
Southwest Sales and Service Center: Information Optoelectronic Industry Base, 188 Guangyao 3rd Road, Qingyang District, Chengdu City, Sichuan Province
South China Sales and Service Center: Honghualing Craftsmanship Industrial Park, Taoyuan Street, Nanshan District, Shenzhen City
Contact Phone: 0086 535 6388095 / 0086 535 3021333 / +8613255522639
Mailbox: nancyzhang@pcm-bj.com
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