Products
HC-EB770 Manual Eutectic Machine
Classification:
Wire Bonder, Die Bonder& Inspection Equipment
Key words:
- Product Description
- Technical Parameters
- Technical Advantage
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Product Introduction :
EB-770 Manual Eutectic Machine is a special equipment for welding the chip of the device to the lead frame in the packaging production of special electronic components, and is one of the key equipment in the packaging production of electronic components.
Application Fields:
Microwave devices, hybrid circuits, MEMS circuits, optoelectronic devices, semiconductor devices, radar devices, military devices, COB/SOB.
Functions:
Eutectic die bonding for thick film circuit, thin film circuit, hybrid circuit, and multi-chip.
Features:
1、Multi-chip eutectic die bonding;
2、Die taking, die placing and being eutectic are realized on the dame machine;
3、Axis θ rotates 360°;
4、1:8 operation handle, precise chip positioning.
Structure and Features:
Eutectic head structure
1、Die taking, solder taking, rubbing and welding are realized at the same time.
2、Axis θ rotates 360°, precise chip positioning.
Eutectic head
1、Mechanical friction: friction speed, frequency and width are programmable;
2、The force and speed of the tweezers can be controlled;
3、Die bonding pressure control ability.
Fixture
1、Special fixture design with N2 protection;
2、Constant temperature heating plate with max. 450℃.
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Die bond head
Z vertical travel by manipulator
14mm
X-Y travel by manipulator
15mm*15mm (ratio 8:1)
Work platform
Elevating table Z travel
18mm (adjustable)
Elevating X-Y area
250mm*270mm
Die bond force
10g-150g
Chip size
0.2mm-25mm
Operation menu
7"TFT LCD, Chinese menu
Power
AC220V±10%(50/60Hz)≤800W
Machine profile
650mm*650mm*400mm
Weight
About 70Kg
Standard configuration
Mainframe, LED illumination, zoom stereo-microscope, workholder, pickup tool
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